Light emitting diode (led) lighting device

ABSTRACT

Various embodiments provide a light emitting diode (LED) module, an LED lighting device comprising an LED module, and methods for manufacturing an LED module and/or an LED lighting device. In one embodiment, the LED lighting device comprises a housing comprising a metal shell and defining a central opening; and an LED module having one or more LEDs mounted about a periphery of a first surface of the LED module. The LED module is oriented and retained within the central opening of the housing such that the first surface faces out of the central opening. Furthermore, the LED module is secured to the housing via the metal shell.

BACKGROUND

Incandescent bulbs are slowly being phased out in favor of moreefficient lighting sources. This led to an increased use of compactfluorescent bulbs which are more efficient than incandescent bulbs, butwhich tend to contain dangerous materials, such as mercury.Additionally, many people find the color temperature of light emitted bycompact fluorescent bulbs to not be aesthetically pleasing for manyapplications, such as household lighting in kitchens, bathrooms, andliving rooms; some commercial applications; and the like.

Recent advances in manufacturing light emitting diodes (LEDs) combinedwith the efficiency and long lifetime of LEDs have led to an increase inthe availability and affordability of LED lighting devices. LED lightingdevices offer advantages over compact fluorescent bulbs including longerlifetime and the absence of dangerous materials. Also, LED lightingdevices may be configured to emit light in a wide range of colortemperatures.

Both incandescent bulbs and compact fluorescent bulbs must be designedto maintain a specific environment within the bulb (e.g., a vacuum or aspecific mix of gasses). LEDs, by contrast, can function under regularatmospheric conditions. However, LEDs are small, solid state devices,often require being powered via electronic driver circuitry, and haveparticular requirements for the dissipation of heat created by and/or inthe vicinity of the LEDs.

Thus, there is a need for LED lighting devices in traditional bulb formfactors.

BRIEF SUMMARY

Various embodiments of the present invention provide an LED module, anLED lighting device (e.g., light bulb, lamp, lighting fixture or thelike) incorporating one or more LED modules, and methods formanufacturing an LED module and/or an LED lighting device comprising oneor more LED modules.

According to one aspect of the present invention, an LED lighting deviceis provided. In one embodiment, the LED lighting device comprises ahousing comprising a metal shell and defining a central opening and anLED module having one or more LEDs mounted about a periphery of a firstsurface of the LED module. The LED module is oriented and retainedwithin the central opening of the housing such that the first surfacefaces out of the central opening. The LED module is secured to thehousing via the metal shell.

According to another aspect of the present invention, an LED module isprovided. In one embodiment, the LED module comprises a circuit boardhaving a first surface; a peripheral metal board abutting and about saidcircuit board; an electrical insulation layer on the first surface ofsaid circuit board and on said peripheral metal board; electrical traceson said electrical insulation layer; and one or more LEDs mounted onsaid electrical traces and said electrical insulation layer and oversaid peripheral metal board.

According to another aspect of the present invention, an LED lightingdevice is provided. In one embodiment, the LED lighting device comprisesa housing. The housing comprises a metal shell defining a centralopening of the housing; a plastic housing over molded onto the metalshell; and a metal insert mounted within the central opening of thehousing. The LED lighting device further comprises an LED module mountedwithin the central opening of the housing. The LED module comprises acomposite board. The composite board comprises a peripheral metal boardhaving an embedding opening; and a circuit board embedded within theembedding opening of the peripheral metal board. The LED module furthercomprises one or more driver circuitry components mounted within a firstportion of the composite board corresponding to the circuit board andone or more LEDs mounted about a periphery of a second portion of thecomposite board corresponding to the peripheral metal board.

According to still another aspect of the present invention, an LEDlighting device is provided. In one embodiment, the LED lighting devicecomprises a housing. The housing comprises a metal shell defining acentral opening of the housing; a plastic housing over molded onto themetal shell; and a metal insert mounted within the central opening ofthe housing. The LED lighting device further comprises an LED modulemounted within the central opening of the housing. The LED modulecomprises a composite board having a first surface and a second surfaceopposite the first surface. The composite board comprises a peripheralmetal board having an embedding opening; and a circuit board embeddedwithin the embedding opening of the peripheral metal board. The LEDmodule further comprises one or more driver circuitry components mountedto the first surface of the composite board and within a first portionof the composite board corresponding to the circuit board; one or moredriver circuitry components mounted to the second surface of thecomposite board and within the first portion of the composite boardcorresponding to the circuit board; and one or more LEDs mounted to thefirst surface of the composite board and about a periphery of a secondportion of the composite board corresponding to the peripheral metalboard.

According to yet another aspect of the present invention, a method formanufacturing an LED lighting device is provided. In one embodiment, themethod comprises die cutting a peripheral metal board. The peripheralmetal board comprises an embedding opening. The method further comprisespress-fitting a circuit board into the embedding opening such that afirst surface of the circuit board is generally flush with a firstsurface of the peripheral metal board. The method further comprisesadhering copper foil to at least the first surface of the peripheralmetal board and the first surface of the circuit board using a partiallydry adhesive that cures to become an electrical insulation layer,etching electrical traces from the copper foil, and mounting one or moreLEDs on the electrical traces and the electrical insulation layer overthe peripheral metal board. The method further comprises securing theperipheral metal board and the circuit board within a central opening ofa metal shell.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

Having thus described the invention in general terms, reference will nowbe made to the accompanying drawings, which are not necessarily drawn toscale, and wherein:

FIG. 1 is a perspective view of an LED lighting device, in accordancewith various embodiments of present invention;

FIG. 2 is a perspective view of a portion of an LED lighting device, inaccordance with various embodiments of the present invention;

FIG. 3 is a structural representation of an LED module, in accordancewith various embodiments of the present invention;

FIG. 4 is a sectional view of the LED module shown in FIG. 3;

FIG. 5 is a perspective view of a first surface of an LED module, inaccordance with various embodiments of the present invention;

FIG. 6 is a perspective view of a second surface of the LED module shownin FIG. 5;

FIG. 7 is a side view of the LED module shown in FIGS. 5 and 6;

FIG. 8 is a flowchart illustrating various processes and procedures thatmay be completed in manufacturing an LED module, in accordance withvarious embodiments of the present invention;

FIG. 9 is a diagram of a metal sheet that has been die stamped in orderto create peripheral metal boards for use in LED modules, in accordancewith various embodiments of the present invention;

FIG. 10 is a schematic diagram of a punching die that may be used tocreate peripheral metal board for use in LED modules and/or to embed acircuit board within a peripheral metal board, in accordance withvarious embodiments of the present invention;

FIG. 11 is a schematic diagram of the state when the punching die shownin FIG. 10 performs the embedding of a circuit board into a peripheralmetal board, in accordance with various embodiments of the presentinvention;

FIG. 12 is a schematic diagram of a pressure unit that may be used inthe bonding of a copper foil to a circuit board and a peripheral metalboard, in accordance with various embodiments of the present invention;

FIG. 13 is a top view of a housing of an LED lighting device, inaccordance with an embodiment of the present invention;

FIG. 14A is a perspective view of the housing shown in FIG. 13;

FIG. 14B is an exploded view of the housing shown in FIG. 14A;

FIG. 15 is a perspective view of an LED module secured within an LEDlighting device housing, in accordance with various embodiments of thepresent invention; and

FIG. 16 is a flowchart illustrating various processes and proceduresthat may be completed in manufacturing an LED lighting device, inaccordance with various embodiments of the present invention.

DETAILED DESCRIPTION OF VARIOUS EMBODIMENTS

The present invention now will be described more fully hereinafter withreference to the accompanying drawings, in which some, but not allembodiments of the inventions are shown. Indeed, these inventions may beembodied in many different forms and should not be construed as limitedto the embodiments set forth herein; rather, these embodiments areprovided so that this disclosure will satisfy applicable legalrequirements. Like numbers refer to like elements throughout.

I. Overview

A light emitting diode (LED) lighting device may be an LED light bulb,lamp, lighting fixture or the like. FIG. 1 shows a perspective view ofan example LED lighting device 100. The illustrated embodiment of a bulbtype LED lighting device 100 comprises a lamp envelope 70, a housing 50,and a base 60.

In example embodiments, the base 60 may be configured to allow the LEDlighting device 100 to be screwed or otherwise secured into a lightsocket (e.g., the light socket of a generic lamp, lighting fixture,and/or the like), and to receive electrical energy therethrough. Forexample, the base 60 may be an Edison type base, A19 base, and/or thelike. In various embodiments, the base 60 may be configured tophysically secure the LED lighting device 100 into a socket and providean electrical connection between the driver circuitry (e.g., comprisingone or more driver circuitry components 40) and a power supply (e.g.,line voltage, a battery). Some embodiments of the LED lighting device100 may not comprise a base. For example, embodiments of the LEDlighting device that are lamps or lighting fixtures may comprise ahousing that is configured to be mounted to a wall or ceiling or placedon a surface (e.g., table, desk, counter, etc.).

In various embodiments, a lamp envelope 70 may be configured to dispersethe light emitted by one or more LEDs 30 (see FIG. 2) mounted within theLED lighting device 100, to enclose the one or more LEDs 30 within theLED lighting device 100, and/or to provide the LED lighting device 100with a particular aesthetic. For example, in example embodiments, thelamp envelope 70 may be a globe or bulb. In the illustrated embodiment,the lamp envelope 70 is configured to provide the LED lighting device100 with the appearance of an incandescent light bulb. In variousembodiments, the lamp envelope 70 may comprise and/or be configured toaccommodate secondary optical components configured to condition thelight emitted by the one or more LEDs. In example embodiments, the lampenvelope 70 may be configured such that light emitted by the one or moreLEDs 30 is incident upon an inside surface of lamp envelope 70 anddispersed outwardly through an outer surface of the lamp envelope 70.

The LED lighting device 100 may also comprise a housing 50. As shown inFIG. 2, the housing 50 may comprise a metal shell 52, a plastic housing51, and a metal insert 54. In various embodiments, the metal shell 52may be generally conical, funnel, or bell-shaped and thereby define acentral opening 53. A plastic housing 51 may be over molded onto themetal shell 52 to provide the LED lighting device 100 with anaesthetically pleasing look and/or to provide the LED lighting device100 with a look that is similar to the familiar appearance of anincandescent light bulb. A metal insert 54 may be mounted within thecentral opening 53 and configured to have an LED module 90 securedthereto.

II. Exemplary LED Module

FIGS. 3-7 illustrate various view of example LED modules 90 that may beincorporated into the LED lighting device 100. In various embodiments,the LED module 90 comprises a peripheral metal board 10, a circuit board20, one or more LEDs 30, one or more driver circuitry components 40, andconnecting wires 35. In example embodiments, a blank circuit board 20 isembedded within a peripheral metal board 10 to provide a compositeboard. The composite board may be configured to structurally support oneor more driver circuitry components 40 and one or more LEDs 30 and todissipate and/or transfer heat created by the operation thereof.

A copper foil 234 may be adhered to the flush surface of the compositeboard (e.g., via a semi-dry adhesive that cures to provide an electricinsulating layer). An etching process may be used to provide traces 233from the copper foil. In various embodiments, a solder mask (e.g., awhite solder mask) is printed on the composite board. One or more drivercircuitry components 40 may be secured to the composite board inelectrical communication with the traces 233 to provide driver circuitryfor an LED module 90. In particular the one or more driver circuitrycomponents 40 may be secured to sites on the composite boardcorresponding to the circuit board 20. Additionally, one or more LEDs 30may be secured to the composite board in electrical communication withthe traces 233 to be driven by the driver circuitry. In variousembodiments, the one or more LEDs 30 are secured to sites on thecomposite board corresponding to the peripheral metal board 10. Thedriver circuitry and the one or more LEDs 30 may be operatively anddirectly connected via the copper traces 233.

In various embodiments, the peripheral metal board 10 may comprise anannular disk made of aluminum or other light weight metal havingappropriate heat transfer properties, having an embedding opening 212therethrough. For example, in one embodiment, the peripheral metal board10 is a metal-core printed circuit board (MCPCB). In exampleembodiments, the thickness of the peripheral metal board 10 is generally0.8-1.5 mm.

The circuit board 20 may be a blank circuit board made from FR-1, FR-4,or other laminated base plate. In various embodiments, the laminatedbase plate may be a multi-layered laminated base plate. For example, thelaminated base plate may comprise a metal core such that circuit boards20 made from the laminated base plate comprise a metal core. In variousembodiments, the circuit board 20 may be and/or may be configured to beComputer Aided Manufacturing (CAM) PCB. In example embodiments, thethickness of the circuit board 20 is generally 0.8-1.5 mm.

In example embodiments, the circuit board 20 is embedded within theembedding opening 212 of the peripheral metal board 10. In variousembodiments, the circuit board 20 is embedded within the embeddingopening 212 such that a first surface of the circuit board 20 isgenerally flush with a first surface of the peripheral metal board 10.In various embodiments, the circuit board 20 and the peripheral metalboard 10 are the same thickness and/or approximately the same thickness,and, thus, the circuit board 20 is embedded with the embedding opening212 such that a second surface of the circuit board 20 is also generallyflush with a second surface of the peripheral metal board 10. In anexample embodiment, both the first surfaces of the peripheral metalboard 10 and the circuit board 20 and the second surfaces of theperipheral metal board and the circuit board are exactly flush. Invarious embodiments, if the circuit board 20 has a metal core, thecircuit board 20 is embedded within the peripheral metal board 10 suchthat the metal core of the circuit board 20 is in thermal communicationwith the peripheral metal board 10.

In various embodiments, the shape of the circuit board 20 matches theouter shape of the embedding opening 212 such that the circuit board 20may be embedded into the embedding opening 212 to form the compositeboard. In various embodiments, the circuit board 20 may be round (e.g.,a circle or ellipse), although other shapes are also contemplated. Theembedding opening 212 may be shaped and sized to accommodate the circuitboard 20 being embedded therein. In example embodiments, the circuitboard 20 is press-fitted into the embedding opening 212. In suchembodiments, the size of the embedding opening 212 is approximately thesize of the circuit board 20. In various embodiments, the circuit board20 may be secured within the embedding opening 212 with adhesive inplace of and/or in addition to press-fitting. In various embodiments,the peripheral metal board 10 is round (e.g., a circle or ellipse). Forexample, the peripheral metal board 10 may be an annulus. In an exampleembodiment, the circuit board 20 defines a circle (e.g., the outer edgeof the circuit board 20), the peripheral metal board 10 defines anannulus, and the circle and the annulus are concentric.

Once the circuit board 20 is embedded within the embedding opening 212,an electric insulation layer 231 (see FIG. 12) is applied to at leastthe first surface of the composite board. In various embodiments, theelectric insulation layer 231 may be formed by curing a semi-dry orthermosetting adhesive onto the composite board. For example, a layer ofinsulating D3451 semi-dry adhesive may be uniformly coated on the firstsurface of the composite board. In one embodiment, the semi-dry adhesiveis applied to both the first and second surfaces of the composite board.The semi-dry adhesive may further be used to adhere a copper foil 234 tothe composite board. The copper foil 234 may then be etched to provideelectrical traces 233 for operatively connecting the driver circuitrycomponents 40, one or more LEDs 30, electrical connecting wires 35,and/or the like. For example, the copper foil 234 may be etched to forma composite printed circuit board (PCB) board. The composite PCB boardmay then be set with (a) one or more driver circuitry components 40 onthe portion of the composite PCB board corresponding to the circuitboard 20 and (b) one or more LEDS on the portion of the composite PCBboard corresponding to the peripheral metal board 10 to form an LEDmodule 90. This formulation of the LED module 90 allows the heat createdby the operation of the one or more LEDs 30 to be easilyradiated/transported away from the one or more LEDs 30 while providing asimplified structure for the driver circuitry and connecting the drivercircuitry to the one or more LEDs 30.

In some embodiments, the one or more LEDs 30 are mounted on traces 233on a first surface of the composite PCB board and at least some of thedriver circuitry components 40 are mounted to a second surface of thecomposite PCB board. For example, one or more LED chips and/or one ormore LED packages may be mounted on the traces 233 on the first surfaceof the composite PCB board at locations corresponding to the peripheralmetal board 10. For example, as shown in FIG. 7, at least some of thedriver circuitry components 40 are mounted on the opposite surface ofthe composite PCB board as the one or more LEDs 30. In exampleembodiments, some driver circuitry components 40 are mounted on firstsurface of the composite PCB board and other driver circuitry components40 are mounted on the second surface of the composite PCB board. Forexample, larger driver circuitry components 40 may be mounted to thesecond surface of the composite PCB board. Such a configuration mayprevent the driver circuitry from interfering with light emitted by theone or more LEDs 30.

In various embodiments, a circular-shaped peripheral metal board 10facilitates the placement of the one or more LEDs 30 in a circularshape. For example, the embedding opening 212 may be a circular holecoaxial with the peripheral metal board 10, so that the peripheral metalboard 10 is in a shape of a circular ring (e.g., annulus), and the oneor more LEDs 30 are set around the surface of the peripheral metal board10 of circular shape. Such placement of the one or more LEDs 30 may befavorable for providing uniform light emitting of the LED module 90 (andtherefor the LED lighting device 100), leads to increased uniformity inheat radiation of the heat created by the operation of the one or moreLEDs 30, and at the same time, facilitates embedding of the circuitboard 20 into the embedding opening 212 of the peripheral metal board10.

In some embodiments, the periphery of the embedding opening 212 is setwith semi-circular protrusions 213, and the said circuit board 20 is setwith semi-circular notches 223 along its periphery to be adapted to thesemi-circular protrusions 213. The semi-circular notches 223 of thecircuit board 20 may be configured to engage with the semi-circularprotrusions 213 of the peripheral metal board 10, which may enableaccurate positioning between the circuit board 20 and the peripheralmetal board 10 and may be favorable for increasing the engagement forcebetween the circuit board 20 and the peripheral metal board 10 toenhance the strength of the composite board. In some embodiments, theouter edge of the circuit board 20 and the inner edge of the embeddingopening 212 may be a circular (e.g., without any notches orprotrusions).

In various embodiments, one or more alignment notches 96 are disposed onthe outer edge of the peripheral metal board 10 and/or one or moreattachment holes 98 are disposed near the periphery of the peripheralmetal board 10. The alignment notches 96 may be configured to assist inthe aligning of the LED module 90 into the appropriate position withinan LED lighting device 100. In example embodiments, the attachment holes98 may be configured to assist in the aligning and/or securing the LEDmodule 90 to the LED lighting device 100.

In various embodiments, the circuit board 20 embedded within the metaldisk 10 provides for driver circuitry components 40 to be mounted toboth the first surface and the second surface of the circuit board 20.Driver circuitry components 40 mounted to the second surface of thecircuit board 20 may extend into housing 50 of LED lighting device 100.

III. Exemplary Method of Manufacturing an LED Module

FIG. 8 provides a flowchart illustrating an example method ofmanufacturing an LED module 90. Starting at step 302, the peripheralmetal board 10 may be die cut. For example, a sheet of metal (e.g.,aluminum) may be die cut to form one or more peripheral metal boards 10.For example, as shown in FIG. 9, in various embodiments, a punching dieis used to die stamp one or more peripheral metal boards 10 of annularshape in a rectangular array on a metal sheet 201 (e.g., with thicknessof 0.8-1.5 mm). In an example embodiment, the outer edges of twoadjacent peripheral metal boards 10 are connected through the connectionstrips 215 with width of 0.5-1 mm. To facilitate subsequent processingof the metal sheet 201, locating holes 214 may also be die stamped atthe diagonal positions of the metal sheet 201 when peripheral metalboards 10 are die stamped on the metal sheet 201.

At step 304, a blank circuit board 20 is press fit into the embeddingopening 212 of the peripheral metal board 10. For example, circuit board20 adapted to the embedding opening in outer shape and of thicknessequal to that of peripheral metal board 10 is obtained by way of diestamping a laminated base plate (e.g., an FR-1, FR-4, multi-layeredmetal core laminated base plate, and/or the like). A circuit board 20may then be embedded within at least one/each embedding opening 212 onthe metal sheet 201 such that the first surface of the circuit board 20is flush with the first surface of the peripheral metal board 10 and thesecond surface of the circuit board 20 is flush with the second surfaceof the peripheral metal board 10.

FIGS. 10 and 11 illustrate an example punching die that may be used todie stamp the peripheral metal board 10 and/or circuit board 20 and/orembed a circuit board 20 into embedding opening 212. As shown in FIG.10, in various embodiments, the punching die comprises the upper die 240and the lower die 250. The upper die 240 comprises the upper die holder241 connected to the press, the punch 242 fixed to the upper die holderand the cylindrical sliding bar 244. The punch 242 comprises the punchmain body 243 used to form the embedding opening 212 of the peripheralmetal board 10. The lower surface of the punch main body 243 is higherthan the lower surface of other parts of the punch 242. The lower partof the upper die holder 241 is also set with a stripper 246. Thestripper 246 is set with the punch lead hole 247 adapted to the punch242 to form a sliding connection with the punch. The stripper 246 mayalso be set with the bar lead hole 248 adapted to the vertical slidingbar 244, so that the stripper 246 can move up and down under the guideof the sliding bar 244. In addition, the lower end of the sliding bar244 is set with a protruding ring to form the hook 245 that can hook andhang the stripper 246. An elastic component 256 is set between thestripper 246 and the upper die holder 241, so that the stripper issuspended at the hook 245 of the lower end of the sliding bar 244. Inthe state of the die stamp shown in FIG. 10, the lower end of the punch242 is located inside the punch lead hole 247. The counterbore 249 maybe set at the lower end of the bar lead hole of the stripper 246 so thatthe position of the hook 245 of the sliding bar 244 can be limited toinside the counterbore 249. The lower die 250 of the punching diecomprises the lower die holder 251 connected to the press and the lowerdie plate 253 set on the lower die holder. The lower die plate 253 isset with the primary punch die hole 254 adapted to the punch 242. Thevertically upward guide post 252 is set at the edge angle of the lowerdie holder 251. The guide sleeve 255 adapted to the guide post 252 isthen respectively set on the lower die plate 251, the stripper 246, andthe upper die holder 241, so that the upper die holder, the stripper,the lower die plate, and the lower die holder can be accuratelypositioned together through use of the guide post 252. Additionally, anelastic component 256 may be set between the lower die plate 253 and thelower die holder 251. A pressure spring or resilient block made ofpolyurethane are examples of the elastic component 256 that may be setbetween the stripper 246 and the upper die holder 241 and/or between thelower die plate 253 and the lower die holder 251. In addition, invarious embodiments, the punching die further comprises an elevation dieplate 270. The elevation die plate is set with the secondary punch diehole 271 adapted to the punch main body 243, and the edge angle of theelevation die plate is set with the guide sleeve 255 adapted to theguide post 252.

When die stamping the metal sheet 201, the metal sheet is firstpositioned on the lower die 250, the press is then started to make theupper die 240 move downward, the stripper 246 of the upper die firstpresses the metal sheet, the elastic component 256 between the stripperand the upper die holder 241 is compressed, the punch extends out of thepunch lead hole to work with the primary punch die hole of the lower dieplate to die stamp peripheral metal boards 10 interconnected withconnection strips on the metal sheet, the punch main body knocks out theembedding opening 212 on the peripheral metal board 10, and the lowerdie plate also moves downward under pressure.

Next, the upper die 250 moves upward to return to the original position,the elastic component 256 between the stripper 246 and the upper dieholder 241 makes the stripper continue its tight attachment to the lowerdie plate 253 to make the stripper and the upper die holder separate,and at this time, the punch retracts again into the punch lead hole 247of the stripper, the die-stamped metal sheet 201 stays on the lower die250, and with the continued upward movement of the upper die 240, thesliding bar 244 makes the stripper 246 move upward synchronously andmutually separate from the die-stamped metal sheet 201, and the lowerdie plate 253 moves upward to return to the original position.

Then, as shown in FIG. 11, the die-stamped metal sheet 201 is coveredwith the elevation die plate 270, and at this time, the guide sleeve 255of the elevation die plate covers the guide post 252 of the lower dieholder 251, so that the secondary punch die hole 271 of the elevationdie plate is accurately positioned with the punch main body 243 aboveand the embedding opening 212 of the peripheral metal board 10 below.Then, the laminated base plate of the same thickness of the peripheralmetal board 10 is placed on the elevation die plate 270, the press isstarted again to make the upper die 240 move downward. The stripper 246of the upper die first presses the laminated base plate, the punchextends out of the punch lead hole 247, the punch main body 243 in thepunch works with the secondary punch die hole 271 of the elevation dieplate 270 to die stamp a mutually separated, blank circuit board 20 fromthe laminated base plate. The circuit board 20 continues to movedownward under the drive of the punch main body 243 and is exactlyembedded into the embedding opening 212 corresponding to the peripheralmetal board 10 at the lower die 250 to form the composite board. Invarious embodiments, the height difference between the punch main body243 and other parts of the punch is equal to the sum of the thicknessesof the elevation die plate 270 and the peripheral metal board 10, whichthus makes sure that the circuit board 20 embedded into the embeddingopening 212 of the peripheral metal board 10 is exactly flush with thefirst and second surfaces of the peripheral metal board 10.

At this time, other parts of the punch abut on the laminated base plate,so as to push the lower die plate 253 to move downward under pressurethrough the stacked laminated base plate, elevation die plate 270 anddie-stamped metal sheet 201. The composite board inside the primarypunch die hole 254 of the lower die plate 253 moves downwardsynchronously, and accordingly, the stripper of the lower die plate alsoabuts on the laminated base plate so as to be flush with other parts ofthe punch.

Finally, the upper die 240 moves upward again to return to the originalposition, the stripper 246 is separated from the upper die holder 241,the punch retracts again into the punch lead hole 247 of the stripper246. The die-stamped metal sheet 201 comprising a plurality ofperipheral metal boards 10 each and/or at least some of which have acircuit board 20 embedded therein stays on the lower die, so that aplurality of composite boards formed through the interconnection of thecomposite boards by the connection strips 214 is obtained.

Returning to FIG. 8, at step 306, a copper foil is adhered to thecomposite board using a semi-dry adhesive. For example, layer ofinsulating semi-dry adhesive 311 is uniformly coated on at least thefirst surface of the plurality of composite boards formed in the diestamped metal sheet 201. For example, a layer of insulating D3451semi-dry adhesive may be uniformly coated on the first surface of theperipheral metal board 10 and circuit board 20 embedded therein. Thesemi-dry adhesive may be used to adhere a whole sheet of copper foil tothe plurality of composite boards formed from embedding a plurality ofcircuit boards 20 into the plurality of peripheral metal boards 10 diestamped from the metal sheet 201.

At step 308, the semi-dry adhesive is cured to form the electricinsulating layer 231. For example, constant pressure may be applied tothe surface of the copper foil, which is baked at a temperature of130°-180° C. for 45-60 minutes, so that the layer of semi-dry adhesive311 is cured and forms an electric insulating layer 231. For example, asshown in FIG. 12, a plurality of metal sheets 201 bonded with the copperfoil 233 through the semi-dry adhesive 232 may be stacked on a bearingplatform 280 in a sealed drying room. The bearing platform may be setwith the locating post corresponding to the locating hole 214 of themetal sheet, and in this way, the locating hole of the metal sheet 201is set as a sleeve on the locating post of the bearing platform 280, sothat accurate positioning can be kept for each layer of the metal sheetsin between. Resilient sleeper bearings 290 made of hightemperature-resistant silica gel may be laid between adjacent metalsheets 201. The thickness of the resilient sleeper bearing may be 1-1.5mm, and a layer of resilient sleeper bearing 290 may also be laid underthe bottom-layer metal sheet 201. The top-layer metal sheet 201 is thencovered on the top with the flexible fluid bag 295 filled inside withliquid. The flexible fluid bag 295 is flat and rectangular in shape, andthe size of the flexible fluid bag should be able to cover a whole sheetof copper foil 233. In addition, the flexible fluid bag is set on thetop with the pressure unit 260. The pressure unit comprises the pressureplate 261 covering the flexible fluid bag 295 as well as the oilcylinder 262 above the pressure plate. The vertically downward pistonrod of the oil cylinder 262 is connected to the pressure plate 261. Inthis way, when the oil cylinder 262 is operated, the piston rod canapply a pressure to the flexible fluid bag 295 through the pressureapplied. The fluid in the flexible fluid bag 295 can transmit uniformlyand consistently the pressure applied by the pressure unit to the toplayer of the stacked metal sheets 201, so as to avoid inconsistency ofpressure at various places of the metal sheets resulting from tinyerrors of parallelism between the pressure plate 261 and the top-layermetal sheet. When tiny protuberances and impurities exist between twolayers of metal sheets 201, because protuberances and impurities will betrapped in the resilient sleeper bearing 290, the resilient sleeperbearing may thus ensure that pressure can be uniformly and consistentlytransmitted between two layers of metal sheets 201, so as to apply aconstant pressure on each layer of metal sheets and ensure that thecopper foil 233 can be reliably bonded to the metal sheet throughsemi-dry adhesive 232.

At step 310, traces 233 are etched in the copper foil 234 to provide acomposite PCB board. For example, traces 233 for operatively connectingthe driver circuitry components 40 and/or the one or more LEDs 30 may beetched from the copper foil 234. For example, etching treatment isperformed on the copper foil 234 on the surface of the composite boardcomponent according to a circuit diagram for the LED module 90, so thatcopper traces 233 for purpose of electric conduction is formed on thecomposite board. For example, an etching treatment may be performed onthe copper foil 234 to create traces 233 for the driver circuitry at alocation on the composite PCB board corresponding to the circuit board20, traces 233 for mounting one or more LEDs 30 at a location on thecomposite PCB board corresponding to the peripheral metal board 10, andtraces 233 for operatively connecting one or more driver circuitrycomponents 40 and one or more LEDs 30.

In embodiments where a plurality of composite PCB boards are formedusing a metal sheet 201, the connection strips 215 that connect each ofthe composite PCB boards are cut off, so that individual composite PCBboards are formed. Because the cross-section of the connection strip 215is relatively small, in some embodiments, the composite boards may bemanually twisted off In some embodiments, all the connection strips 215on the whole metal sheet 201 can be cut off at one time by way of diestamping, thereby greatly enhancing the production efficiency.

At step 312, one or more driver circuitry components 40 are operativelymounted to the composite PCB board at a location corresponding to thecircuit board 20. For example, one or more driver circuitry components40 are set on the composite PCB board at a site corresponding to thecircuit board 20. For example, one or more driver circuitry components40 may be disposed on traces 233 on the circuit board 20 to provide adriver circuitry configured to drive/operate one or more LEDs. Inexample embodiments, at least some of the one or more driver circuitrycomponents 40 are mounted on a second surface of the composite PCBboard. In various embodiments, at last one of the one or more drivercircuitry components 40 is mounted on the first surface of the compositePCB board.

At step 314, one or more LEDs 30 (e.g., one or more LED chips and/or oneor more LED packages) are operatively mounted to the composite PCB boardat a location corresponding to the peripheral metal board 10. Forexample, one or more LEDs 30 are set on the composite PCB board at asite corresponding to the peripheral metal board 10. For example, one ormore LEDs 30 may be set on traces 233 on the peripheral metal board 10.The traces 233 formed from the conductive copper foil 234 may beconfigured to operatively connect the one or more LEDs 30 mounted on theportion of the composite PCB board corresponding to the peripheral metalboard 10 and the one or more driver circuitry components 40 mounted onthe portion of the composite PCB board corresponding to the circuitboard 20. In various embodiments, the one or more LEDs 30 are mounted ona first surface of the composite PCB board.

IV. Exemplary LED Lighting Device

In various embodiments, an LED lighting device 100 may be an LED lightbulb, an LED lamp, an LED lighting or lamp fixture, and/or the like. Asshown in FIGS. 1 and 2, various embodiments of an LED lighting device100 comprise a base 60, a housing 50, an LED module 90, and a lampenvelope 70.

In general, the LED module 90 comprises one or more LEDs (e.g., one ormore LED chips and/or one or more LED packages) and the circuitryrequired for operating the one or more LEDs. An example LED module 90that may be used in an LED lighting device 100 is described above. Invarious embodiments, the one or more LEDs 30 may be an alternatingcurrent (AC) driven LED. In other embodiments, the one or more LEDs 30may be a direct current (DC) driven LED. In some embodiments, no drivercircuitry is necessary to operate the one or more LEDs 30.

In various embodiments, the driver circuitry (e.g., comprising one ormore driver circuitry components 40) may comprise a circuit portionconfigured to convert AC voltage into DC voltage. In some embodiments,the driver circuitry may comprise a circuit portion configured tocontrol the current flowing through the one or more LEDs 30. In certainembodiments, the driver circuitry may comprise a circuit portionconfigured to dim the one or more LEDs 30. In various embodiments,additional circuit components may be present in the driver circuitry.Similarly, in various embodiments, all or some of the circuit portionsmentioned here may not be present in the driver circuitry. In someembodiments, circuit portions listed herein as separate circuit portionsmay be combined into one circuit portion. As should be appreciated, avariety of driver circuitry configurations are generally known andunderstood in the art and any of such may be employed in variousembodiments as suitable for the intended application, without departingfrom the scope of the present invention.

The one or more LEDs 30 may be of various color temperatures or variouscolors. In various embodiments, the one or more LEDs 30 may be blue LEDsusing phosphor to convert blue light to white light. In otherembodiments, at least one of the one or more LEDs 30 may be a coloredLED, such as a red, blue, green, or other colored LED. In variousembodiments, different LEDs 30 secured within the same LED module 90 mayhave different color temperatures. In other embodiments, all LEDs 30 inthe LED module 90 are designed to have approximately the same colortemperature. For each embodiment, the color temperature of the one ormore LEDs 30 may be chosen as appropriate for the expected use of theLED lighting device 100.

The LED module 90 may be configured to be secured to and/or withinhousing 50. For example, as shown in FIGS. 2, 13, 14A, 14B, and 15, thehousing 50 may comprise a metal shell 52 with a plastic housing 51molded thereover (e.g., via over molding). In example embodiments, themetal shell 52 may be generally conical, funnel, or bell-shaped anddefine a central opening 53 therein. In example embodiments, the overallshape is the same or similar to standard lamp form factors. The housing50 may further comprise a metal insert 54 secured within the centralopening 53 and/or within the mouth of the central opening. In variousembodiments, the metal insert 54 may be configured to secure the LEDmodule 90 to the housing 50 (e.g., within the central opening 53 and/orapproximately flush with the mouth of the central opening 53) and placethe LED module 90 in thermal communication with the metal shell 52. Forexample, the metal shell 52 may be configured to act as a heat sink forthe LED lighting device 100. In various embodiments, the metal insert 54and the metal shell 52 may be one piece of metal and/or integrallyformed with the metal shell 52. In other embodiments, the metal insert54 and metal shell 52 are formed separately and the metal insert 54 isthen secured within the central opening 53 of the metal shell 52. Forexample, the metal insert 54 may be press-fitted and/or adhered withinthe central opening 53 of the metal shell 52. For example, FIG. 14Bshows an exploded view of the housing 50 before the ring or annulusshaped metal insert 54 is secured within the central opening 53 and FIG.14A shows a perspective view of the housing 50 after the ring or annulusshaped metal insert is press-fitted into the central opening 53 of themetal shell 52.

As described above, the LED module 90 may comprise one or more alignmentnotches 96 and/or one or more attachment holes 98. The metal insert 54and/or a portion of the metal shell 52 may comprise correspondingalignment posts 56 and/or attachment holes 58. For example, the one ormore alignment notches 96 may be configured to engage one of the one ormore alignment posts 56 therein when the LED module 90 is secured tometal insert 54. In another example, the one or more attachment holes 98of the LED module 90 may be configured to align with a correspondingattachment hole 58 of the metal insert 54 such that a fastener 59 (e.g.,a screw, rivet, and/or the like) may be threaded and/or disposed thereinfor securing the LED module 90 to the metal insert 54. Thus, the LEDmodule 90 may be quickly and easily aligned to the metal insert 54and/or metal shell 52 and secured thereto.

In various embodiments, the LED lighting device 100 may define asymmetry axis. For example, the exterior of the LED lighting device 100may define an axis of rotational symmetry. For example, thecross-section of the base 60, housing 50, and lamp envelope 70perpendicular to a symmetry axis may all be approximately circular. Forexample, the housing 50 may define an axis along the length of thehousing 50. The composite board (e.g., the peripheral metal board 10with the circuit board 20 embedded therein) defines a plane. In exampleembodiments, when the LED module 90 is secured within the housing 50,the plane defined by the composite board may be perpendicular to theaxis of the housing and/or LED lighting device 100. For example, in FIG.15, the axis of the housing 50 may be coming out of the page and theplane defined by the LED module 90 is in the plane of the page.

As shown in FIGS. 6 and 7, the LED module may comprise connecting wires35. The connecting wires 35 may be in electrical communication with oneor more driver circuitry components 40 (e.g., via traces 233). Theconnecting wires 35 may be configured to provide an electric current(e.g., from line voltage, a battery, etc.) to the driver circuitry ofthe LED module 90. In various embodiments, the connecting wires 35 maybe secured to electrical contacts on the base 60 such that when the LEDlighting device 100 is secured within a socket, the driver circuitry ofthe LED module 90 is placed in electrical communication with a powersource (e.g., line voltage, a battery, etc.).

V. Exemplary Method of Manufacturing an LED Lighting Device

FIG. 16 provides a flowchart of an exemplary method of manufacturing anLED lighting device 100. Starting at step 402, an LED module 90 isprepared. In example embodiments, an LED module 90 may be prepared asdescribed above with respect to FIG. 8.

At step 404, the LED module 90 may be secured within the central opening53 of the housing 50. For example, the LED module 90 may be secured tothe metal insert 54 such that the driver circuitry components 40 mountedto the second surface of the composite board are disposed within thecentral opening 53 of the housing 50 and the one or more LEDs 30 arepositioned to emit light in a direction generally outward from thecentral opening 53. Any alignment notches 96 of the LED module 90 may bealigned with the corresponding alignment posts 56 of the metal insert 54and any attachment holes 98 of the LED module 90 may be aligned withcorresponding attachment holes 58 of the metal insert 54. Fasteners 59may then be used to secure the LED module 90 to the housing (e.g., themetal insert 54). In some embodiments a thermal grease may be used tosecure the LED module 90 to the housing 50 and/or to ensure good thermalcommunication between the peripheral metal board 10 of the LED module 90and the metal insert 54 and/or metal shell 52.

At step 406, the LED module 90 may be electrically connected to the base60. For example, the connecting wires 35 may be electrically connectedto electrical contacts of the base 60. For LED lighting devices 100 thatdo not comprise a base 60, the connecting wires 35 may be electricallyconnected to other circuitry of the LED lighting device 100, connectedto a power supply (e.g., line voltage, batteries, etc.), and/or thelike. Additionally, the base 60 may be secured to the housing 50. Atstep 408, the lamp envelope 70 may be secured to the housing 50. Forexample, the lamp envelope 70 may be secured to the housing 50 such thatthe LED module 90 is enclosed in the central opening 53 by the lampenvelope 70. In various embodiments, the lamp envelope 70 may be snappedonto, threaded onto, glued onto, and/or otherwise secured to the housing50.

VI. CONCLUSION

Many modifications and other embodiments of the inventions set forthherein will come to mind to one skilled in the art to which theseinventions pertain having the benefit of the teachings presented in theforegoing descriptions and the associated drawings. Therefore, it is tobe understood that the inventions are not to be limited to the specificembodiments disclosed and that modifications and other embodiments areintended to be included within the scope of the appended claims.Although specific terms are employed herein, they are used in a genericand descriptive sense only and not for purposes of limitation.

1. A light emitting diode (LED) lighting device comprising: a housingcomprising a metal shell and defining a central opening; and an LEDmodule having one or more LEDs mounted about a periphery of a firstsurface of the LED module, wherein: the LED module is oriented andretained within the central opening of the housing such that the firstsurface faces out of the central opening, and the LED module is securedto the housing via the metal shell.
 2. The LED lighting device accordingto claim 1, wherein the housing further comprises a metal insertarranged within the central opening of the housing, the metal insertcomprising a central opening.
 3. The LED lighting device according toclaim 2, wherein the central opening of the metal insert is concentricwith the central opening of the metal shell.
 4. The LED lighting deviceaccording to claim 2, wherein the LED module is secured to the metalinsert.
 5. The LED lighting device according to claim 2 wherein themetal insert is press-fitted within the central opening.
 6. The LEDlighting device according to claim 2 wherein the LED module is inthermal communication with either the metal shell, the metal insert, orboth.
 7. The LED lighting device according to claim 1, wherein the LEDmodule comprises: a circuit board having a first surface; a peripheralmetal board abutting and about said circuit board; an electricalinsulation layer on said first surface of said circuit board and on saidperipheral metal board; electrical traces on said electrical insulationlayer; and one or more LEDs mounted on said electrical traces and saidelectrical insulation layer and over said peripheral metal board.
 8. TheLED lighting device according to claim 1 wherein said housing furthercomprises a plastic housing that is over-molded onto said metal shell.9. The LED lighting device according to claim 1 wherein said housingdefines an axis along a length of said housing, and wherein said LEDmodule is configured to be oriented perpendicular to the axis of saidhousing.
 10. The LED lighting device according to claim 1 wherein saidLED module further comprises a double-sided circuit board and at leastone driver circuit component, the at least one driver circuit componentmounted to at least one of a first surface of said circuit board or asecond surface of said circuit board, said second surface being oppositesaid first surface.
 11. The LED lighting device according to claim 10wherein said at least one driver component comprises at least two drivercomponents, wherein a first driver component of said at least two drivercomponents is mounted to said first surface of said circuit board, andwherein a second driver component of said at least two driver componentsis mounted to said second surface of said circuit board.
 12. The LEDlighting device according to claim 10 wherein said LED module furthercomprises a peripheral metal board abutting and about said circuitboard, said one or more LEDs mounted to a first surface of saidperipheral metal board.
 13. The LED lighting device according to claim12 wherein an outer edge of said circuit board defines a first circleand an outer edge of said peripheral metal board defines a second circleand wherein said first circle and said second circle are concentric 14.The LED lighting device according to claim 1, wherein said LED modulecomprises a circuit board and a peripheral metal board abutting andabout said circuit board, wherein said circuit board is a multi-layeredcircuit board having a metal core and wherein said peripheral metalboard is in thermal communication with said metal core. 15-33.(canceled)
 34. A light emitting diode (LED) lighting device comprising:a housing comprising: a metal shell defining a central opening of thehousing; a plastic housing over molded onto the metal shell; and a metalinsert mounted within the central opening of the housing; and an LEDmodule mounted within the central opening of the housing and comprising:a composite board having a first surface and a second surface oppositethe first surface, the composite board comprising: a peripheral metalboard having an embedding opening; and a circuit board embedded withinthe embedding opening of the peripheral metal board; one or more drivercircuitry components mounted to the first surface of the composite boardand within a first portion of the composite board corresponding to thecircuit board; one or more driver circuitry components mounted to thesecond surface of the composite board and within the first portion ofthe composite board corresponding to the circuit board; and one or moreLEDs mounted to the first surface of the composite board and about aperiphery of a second portion of the composite board corresponding tothe peripheral metal board.